24 Mär
24. März 2019 27. März 2019
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

EuroSime 2019

  • Multi-physics simulation (e.g. vibrational, thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electromechanics, fluid structure interactions)
  • Material characterization, experiments and modelling
  • Integrated process modelling
  • Simulation-based optimization, virtual prototyping and prequalification in product and process design
  • Advanced numerical and analytical simulation methodologies and tools
  • Multiscale modelling and simulation
  • Compact modelling and model order reduction
  • Behavioral modelling
  • Experimental methods for validation of simulation models
  • Failure analysis and failure mode extraction
  • Failure criteria and damage modelling for reliability prediction
  • Prognostics and Health Management
  • Additive Manufacturing 3D Printing, 3D packaging
  • End-of-Life estimation of electronic components under vibration
  • FE Methods to derive the dynamic response under vibration

Veranstalter

IMS-AS-RESRI local Organiser

Termin

24. März 2019 27. März 2019
10:00 Uhr - 17:00 Uhr

Anmeldefrist

24. März 2019

Kontakt

apl.Prof.Dr.-Ing. Kirsten Weide-Zaage
IMS-AS-RESRI
Appelstrasse 4
30167 Hannover
Tel.: 7625024
weide-zaage@ims.uni.hannover.de

Ort

Courtyard Hannover Maschsee
Arthur-Menge-Ufer 3
Arthur-Menge-Ufer 3 Hannover

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